low value flat chip resistor lrc/lrf series www.bitechnologies.com www.irctt.com www.welwyn-tt.com general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc 03.13 standard 2512, 2010 and 1206 sizes resistance values down to 0.003 ohms leach resistant solder-plated copper wrap-around termination aec-q200 qualifed h w d l protective overcoat resistive element copper termination solder plating nickel barrier layer alumina substrate copper wraparound termination 2152 / 0102 / 6021 rl low v alue fla t chip resisto r lrc/lrf serie s s standard 2512, 2010 and 1206 sizes s resistance values down to 0.003 ohms s leach resistant solder-plated copper wrap-around termination s low inductance - less than 0.2nh s aec-q200 qualified general note welwyn components reserves the right to make changes in product specification without notice or liability. all information is subject to welwyn?s own data and is considered accurate at time of going to print. ? welwyn components limited bedlington, northumberland ne22 7aa, uk telephone: +44 (0) 1670 822181 facsimile: +44 (0) 1670 829465 email: info@welwyn-tt.com website: www.welwyn-tt.com electrical dat a physical dat a 04.10 a subsidiary of tt electronics plc welwyn components 23 lr1206 lr2010 lr2512 *0.2/5.1 0.1 5.0 s t t aw c07 ta gn i tar rewop r1 o t 300r0 r1 o t 300r0 r1 o t 010r0smho egna r e c na t s i s er 002 002 002 s t l ov egat lov gnidnatsht iw c i r tceleid ) smho 050 . 0 wo l e b e u l a v r o f y r o t c a f t c a t noc ( 001 c / mp p rc t % e c na r e l o t e c na t s i s er r005 5%, >r005 1, 2, 5% 09 08 04 c rewop detar ta es i r erutarepmet pad and trace area for max power rating @ 70c mm 2 30 30 100 *2 watts with total solder pad and trace size of 300 mm 2 dimensions (mm) 1d d ) x am ( h w l ez i s lr1206 3.200.305 1.630.203 0.8 0.480.25 0.480.25 lr2010 5.230.38 2.640.25 0.8 0.480.25 0.480.25 lr2512 6.500.38 3.250.25 0.8 0.480.25 0.480.25 lrc-lrf_e.qxd 12/23/04 10:07 am page 1 h w d l protective overcoat resistive element copper termination solder plating nickel barrier layer alumina substrate copper wraparound termination 2152 / 0102 / 6021 rl low v alue flat chip resistor lrc/lrf series s standard 2512, 2010 and 1206 sizes s resistance values down to 0.003 ohms s leach resistant solder-plated copper wrap-around termination s low inductance - less than 0.2nh s aec-q200 qualified general note welwyn components reserves the right to make changes in product specification without notice or liability. all information is subject to welwyn?s own data and is considered accurate at time of going to print. ? welwyn components limited bedlington, northumberland ne22 7aa, uk telephone: +44 (0) 1670 822181 facsimile: +44 (0) 1670 829465 email: info@welwyn-tt.com website: www.welwyn-tt.com electrical data physical data 04.10 a subsidiary of tt electronics plc welwyn components 23 lr1206 lr2010 lr2512 *0.2/5.1 0.1 5.0 s t t aw c07 ta gni tar rewop r1 o t 300r0 r1 o t 300r0 r1 o t 010r0smho egna r e cna t s i s er 002 002 002 s t l ov egat lov gnidnatsht iw ci rtceleid ) smho 050 . 0 wo l eb eu l a v r o f y r o t c a f t c a t noc ( 001 c / mp p rct % e cna r e l o t e cna t s i s er r005 5%, >r005 1, 2, 5% 09 08 04 c rewop detar ta es i r erutarepmet pad and trace area for max power rating @ 70c mm 2 30 30 100 *2 watts with total solder pad and trace size of 300 mm 2 dimensions (mm) 1d d ) x am ( h w l ez i s lr1206 3.200.305 1.630.203 0.8 0.480.25 0.480.25 lr2010 5.230.38 2.640.25 0.8 0.480.25 0.480.25 lr2512 6.500.38 3.250.25 0.8 0.480.25 0.480.25 lrc-lrf_e.qxd 12/23/04 10:07 am page 1
low value flat chip resistor lrc/lrf series www.bitechnologies.com www.irctt.com www.welwyn-tt.com general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc 03.13 low v alue flat chip resistor lrc/lrf series ? welwyn components limited bedlington, northumberland ne22 7aa, uk telephone: +44 (0) 1670 822181 facsimile: +44 (0) 1670 829465 email: info@welwyn-tt.com website: www.welwyn-tt.com 04.10 welwyn components dimensions (mm) a b c lr1206 2.0 4.0 1.25 lr2010 3.05 6.5 1.5 lr2512 3.7 7.75 1.5 note: 1. although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on fr4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. full aec-q200 qualification applies to ohmic values r01. a c b lrc-lrf_e.qxd 12/23/04 10:07 am page 2 lrc 2512 1 w att lrc 2512 2 w att lrc 2010 0.5 watt lrc 2010 1 w att lrc 1206 0.25 w att lrc 1206 0.5 w att 25 70 150 (c) 0 20 40 60 80 100 (%) power rating ambient temperature ordering pro ce dure example: lrf 2512 a t 10 mi ll iohms ( hen ce f li p-chip mo unt ed) and 2% t oler an ce on a r eel of 1800 pieces l r f 2 5 1 2 ? r 0 1 g w type moun ting c on venti on al (element up) values > r 025 f flip - chip (ele ment do wn) size val ue (use iec62 c ode) toler an ce (use iec62 c ode) f 1% g 2% j 5% packi ng w t ape 1206 or 2010 3000/r eel st and ard 2512 1800/r eel t1 all sizes 1000/r eel values < r 025 aec-q200 table 7 method max. (add r05) typ. (@1r0) ref test 3 high temp. exposure mil-std-202 method 108 r% 0.5 0.2 4 temperature cycling jesd22 method ja-104 r% 0.25 0.1 6 moisture resistance mil-std-202 method 106 r% 0.5 0.2 7 biased humidity mil-std-202 method 103 r% 0.5 0.2 8 operational life (cyclic load) mil-std-202 method 108 r% 1 0.5 14 vibration mil-std-202 method 204 r% 0.5 0.05 15 resistance to soldering heat mil-std-202 method 210 r% 0.25 0.05 16 thermal shock mil-std-202 method 107 r% 0.25 0.1 18 solderability j-std-002 >95% coverage 21 board flex aec-q200-005 r% 0.5 0.2 22 terminal strength aec-q200-006 r% 0.25 0.1 short term overload 6.25 x pr for 2s r% 0.5 low temperature storage -65c for 100 hours r% 0.5 leach resistance solder dip at 250c 90s minimum
|
